Bond-Haggard Endowed Scholarship (Herff College of Engineering)

1. This award shall be used as financial support to a junior or senior student
2. Majoring in Engineering Technology
3. Minimum 2.5 GPA

Award
Varies
Deadline
02/01/2020
Supplemental Questions
  1. Standard Question
    • Please provide a personal statement as to why you are applying for this scholarship. Include any pertinent information about financial need, your family situation, and any other special information we should consider. Additionally, provide a list of all applicable extracurricular activities you feel should be considered. Ensure you include involvement with on and off campus organizations which have helped your personal and professional growth.
    • Please upload your resume.